gaas dpdt switch dc - 2.0 ghz MASW2040 m/a-com inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. m/a-com makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does m/a-com assume any liability whatsoever arising out of the use or application of any product(s) or information. ? north america tel: 800.366.2266 / fax: 978.366.2266 ? europe tel: 44.1908.574.200 / fax: 44.1908.574.300 ? asia/pacific tel: 81.44.844.8296 / fax: 81.44.844.8298 visit www.macom.com for additional data sheets and product information. v3 1 features ? cascadable ? low insertion loss ? low dc power consumption ? low distortion operation (quiet mode) ? useful as a building block for -digital attenuators -digital delay lines -digital phase shifters -digital switched filter elements description m/a-com?s MASW2040 is a gaas mmic dpdt switch die. the MASW2040 is ideally suited for use where low power consumption is required. typical applications include transmit/receive switching, switch matrices, and switched filter banks in systems such as radio and cellular equipment, pcm, gps, fiber optic modules, and other battery powered radio equipment. ordering information part number package MASW2040 die pad layout parameter absolute maximum control value (a or b) -8.5 vdc storage temperature -65c to +175c max operating temperature +175c max input rf power +34 dbm absolute maximum rating 1,2 1. exceeding any one or combination of these limits may cause permanent damage to this device. 2. m/a-com does not recommend sustained operation near these survivability limits. die size?inches (mm) 0.043 x 0.037 x 0.010 (1.10 x 0.94 x 0.25) schematic bond pad dimensions bond pad dimensions - inches (mm) rf1, rf2 0.004 x 0.007 (0.102 x0.182) rfa1, rfb1 0.005 x 0.004 (0.133 x 0.100) rfa2, rfb2 0.005 x 0.004 (0.133 x 0.100) a, b, ac, bc 0.004 x 0.004 (0.100 x 0.100) rfa1 rfa2 rfb1 rfb2
gaas dpdt switch dc - 2.0 ghz MASW2040 m/a-com inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. m/a-com makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does m/a-com assume any liability whatsoever arising out of the use or application of any product(s) or information. ? north america tel: 800.366.2266 / fax: 978.366.2266 ? europe tel: 44.1908.574.200 / fax: 44.1908.574.300 ? asia/pacific tel: 81.44.844.8296 / fax: 81.44.844.8298 visit www.macom.com for additional data sheets and product information. v3 2 electrical specifications: 0 / -5 vdc, -55c to +85c parameter test conditions units min. typ. max. insertion loss dc - 0.5 ghz dc - 1.0 ghz dc - 2.0 ghz db db db ? ? ? ? ? ? 0.4 0.4 0.6 isolation dc - 0.5 ghz dc - 1.0 ghz dc - 2.0 ghz db db db 25 20 15 ? ? ? ? ? ? vswr dc - 0.5 ghz dc - 1.0 ghz dc - 2.0 ghz ratio ratio ratio ? ? ? ? ? ? 1.1:1 1.2:1 1.2:1 input p-1db 0.05 ghz (0 / -5 v, 0 / -8v) 0.5 - 2.0 ghz (0 / -5 v, 0 / -8v) dbm dbm ? ? +24, +25 +30, +33 ? ? ip2 two tone input power up to +5 dbm 0.05 ghz 0.5 - 2.0 ghz dbm dbm ? ? +62 +68 ? ? ip3 two tone input power up to +5 dbm 0.05 ghz 0.5 - 2.0 ghz dbm dbm ? ? +39 +46 ? ? control current v in low (0 to -0.2 v) v in high (-5 v @ 25 a typ to -8 v) a a ? ? ? ? 9 75 t-rise, t-fall 10% to 90% rf and 90% to 10% rf ns ? 3 ? t on , t off 50% control to 90% rf, and 50% control to 90% rf ns ? 6 ? transients in band mv ? 20 ? truth table 3 handling procedures please observe the following precautions to avoid damage: static sensitivity gallium arsenide integrated circuits are sensitive to electrostatic discharge (esd) and can be damaged by static electricity. proper esd control techniques should be used when handling these devices. control inputs a b rf1- rfa1 rf1- rfb1 rf2- rfa2 rf2- rfb2 1 0 off on off on 0 1 on off on off condition of switch 3. 0 = 0 to ?0.2 v, 1 = -5 v.
gaas dpdt switch dc - 2.0 ghz MASW2040 m/a-com inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. m/a-com makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does m/a-com assume any liability whatsoever arising out of the use or application of any product(s) or information. ? north america tel: 800.366.2266 / fax: 978.366.2266 ? europe tel: 44.1908.574.200 / fax: 44.1908.574.300 ? asia/pacific tel: 81.44.844.8296 / fax: 81.44.844.8298 visit www.macom.com for additional data sheets and product information. v3 3 typical performance @ 25c handling precautions permanent damage to the MASW2040 may occur if the following precautions are not adhered to: a. cleanliness - the MASW2040 should be handled in a clean environment. do not attempt to clean unit after the MASW2040 is installed. b. static sensitivity - all chip handling equipment and personnel should be dc grounded. c. transient - avoid instrument and power supply transients while bias is applied to the MASW2040. use shielded signal and bias cables to minimize inductive pick-up. d. bias - apply voltage to either control port a or b only when the other is grounded. neither port should be allowed to ?float.? e. general handling - it is recommended that the MASW2040 chip be handled along the long side of the die with a sharp pair of bent tweezers. do not touch the surface of the chip with fingers or tweezers. mounting the MASW2040 is back-metallized with pd/ni/au (100/1,000/10,000?) metallization. it can be die- mounted with ausn eutectic performs or with thermally conductive epoxy. the package surface should be clean and flat before attachment. eutectic die attach: a. a 80/20 gold/tin preform is recommended with a work surface temperatur e of approximately 255c and a tool temperature of 265c. when not 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be approximately 290c. b. do not expose the m asw2040 to a temperature greater than 320c for more than 20 seconds. no more than 3 seconds for scrubbing should be required for attachment. epoxy die attach: a. apply a minimum amount of epoxy and place the MASW2040 into position. a thin epoxy fillet should be visible around the perimeter of the chip. b. cure epoxy per manufacturer?s recommended schedule. wire bonding a. ball or wedge with 1.0 mil diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150c and a ball bonding force of 40 to 50 grams or wedge bonding force o1 18 to 22 grams is recommended. ultrasonic energy and time should be adjusted to the minimum levels achieve reliable wirebonds. b. wirebonds should be started on the chip and terminated on the package. gnd bonds should be as short as possible; at least three and no more than four bond wires from ground pads to package are recommended. 0 10 20 30 40 0.0 0.5 1.0 1.5 2.0 frequency (ghz) isolation vs. frequency insertion loss vs. frequency 0.0 0.25 0.50 0.75 1.0 0.0 0.5 1.0 1.5 2.0 frequency (ghz) 1.0 1.1 1.2 1.3 1.4 1.5 0.0 0.5 1.0 1.5 2.0 frequency (ghz) vswr vs. frequency
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